IZM - ASSID

Fraunhofer IZMs with its center “All Silicon System Integration Dresden – ASSID” covers all the competencies needed for advanced WL packaging and 3D IC and heterogeneous system integration. IZM-ASSID operates a leading-edge 200/300mm process line for TSV formation, TSV post-processing, pre-assembly, 3D wafer-level assembly and stack formation as well as related metrology tools and equipment. The facility, infrastructure and know-how are especially tailored to partners in industry for research and development projects, as well as prototype realization.

Facility & Infrastructure
Clean Room: 970 m²
Equipment: Cu-TSV Formation Pre-Assembly (Wafer Thinning, Handling, Dicing)
3D Stacking and Assembly

All tool specifications are aligned to the requirements for specific applications and customer requests to 3D technology for TSV formation, silicon interposer and multifunctional device integration. Tools are leading edge developments of selected supplier and aligned to process development, prototyping and low volume manufacturing under industrial manufacturing conditions.